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Chemical content PDTA123YMB

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Type numberPackagePackage descriptionTotal product weight
PDTA123YMBSOT883BXQFN30.69026 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065926315512601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33031
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04550
Phenolic resinProprietary0.0004113.530000.05880
subTotal0.00300100.000000.43461
DieDoped siliconSilicon (Si)7440-21-30.04000100.000005.79492
subTotal0.04000100.000005.79492
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09735
Copper (Cu)7440-50-80.2632094.0000038.13056
Tin (Sn)7440-31-50.000670.240000.09735
Zinc (Zn)7440-66-60.000590.210000.08519
Pure metal layerGold (Au)7440-57-50.000220.080000.03245
Nickel (Ni)7440-02-00.013834.940002.00388
Palladium (Pd)7440-05-30.000810.290000.11764
subTotal0.28000100.0000040.56442
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.32906
Silica fused60676-86-00.2040060.0000029.55408
Flame retardantMetal hydroxideProprietary0.010203.000001.47770
ImpurityBismuth (Bi)7440-69-90.001700.500000.24628
PigmentCarbon black1333-86-40.001700.500000.24628
PolymerEpoxy resin systemProprietary0.023807.000003.44798
Phenolic resinProprietary0.020406.000002.95541
subTotal0.34000100.0000049.25679
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00161
Tin solderTin (Sn)7440-31-50.0199999.940002.89572
subTotal0.02000100.000002.89746
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0072699.990001.05153
subTotal0.00726100.000001.05164
total0.69026100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.