Chemical content PDTA124XQC

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Type numberPackagePackage descriptionTotal product weight
PDTA124XQCSOT8009DFN1412D-32.43277 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662958147212601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0106476.000000.43736
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0014710.470000.06025
Phenolic resinProprietary0.0018913.530000.07786
DieDoped siliconSilicon (Si)7440-21-30.05000100.000002.05527
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792044.78438
Magnesium (Mg)7439-95-40.001700.145400.06981
Nickel (Ni)7440-02-00.033982.908901.39660
Silicon (Si)7440-21-30.007360.630300.30261
Pure metal layerGold (Au)7440-57-50.000440.037300.01791
Nickel (Ni)7440-02-00.033552.872201.37898
Palladium (Pd)7440-05-30.001480.126700.06083
Mould CompoundFillerSilica -amorphous-7631-86-90.088747.980003.64760
Silica fused60676-86-00.8906280.0920036.60942
PigmentCarbon black1333-86-40.010320.928000.42418
PolymerEpoxy resin systemProprietary0.093968.450003.86243
Phenolic resinProprietary0.028362.550001.16558
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000050.055500.00189
Tin solderTin (Sn)7440-31-50.0829599.940003.40970
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0057799.990000.23724
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.