Chemical content PDTA143XQB-Q

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Type numberPackagePackage descriptionTotal product weight
PDTA143XQB-QSOT8015DFN1110D-31.59992 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934663474147212601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0053276.000000.33252
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0007310.470000.04581
Phenolic resinProprietary0.0009513.530000.05920
DieDoped siliconSilicon (Si)7440-21-30.02600100.000001.62508
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860044.92767
Magnesium (Mg)7439-95-40.001120.149000.07003
Nickel (Ni)7440-02-00.022422.980901.40109
Silicon (Si)7440-21-30.004860.645900.30359
Pure metal layerGold (Au)7440-57-50.000060.007700.00362
Nickel (Ni)7440-02-00.004470.594000.27919
Palladium (Pd)7440-05-30.000270.036500.01716
Mould CompoundFillerSilica -amorphous-7631-86-90.060017.980003.75079
Silica fused60676-86-00.6022980.0920037.64512
PigmentCarbon black1333-86-40.006980.928000.43618
PolymerEpoxy resin systemProprietary0.063548.450003.97170
Phenolic resinProprietary0.019182.550001.19856
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00198
Tin solderTin (Sn)7440-31-50.0569799.940003.56054
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0059299.990000.36998
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.