Chemical content PDTA143XQC-Q

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Type numberPackagePackage descriptionTotal product weight
PDTA143XQC-QSOT8009DFN1412D-32.40877 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934663492147212601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0106476.000000.44172
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0014710.470000.06085
Phenolic resinProprietary0.0018913.530000.07864
DieDoped siliconSilicon (Si)7440-21-30.02600100.000001.07939
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792045.23060
Magnesium (Mg)7439-95-40.001700.145400.07050
Nickel (Ni)7440-02-00.033982.908901.41051
Silicon (Si)7440-21-30.007360.630300.30563
Pure metal layerGold (Au)7440-57-50.000440.037300.01809
Nickel (Ni)7440-02-00.033552.872201.39271
Palladium (Pd)7440-05-30.001480.126700.06144
Mould CompoundFillerSilica -amorphous-7631-86-90.088747.980003.68394
Silica fused60676-86-00.8906280.0920036.97418
PigmentCarbon black1333-86-40.010320.928000.42841
PolymerEpoxy resin systemProprietary0.093968.450003.90091
Phenolic resinProprietary0.028362.550001.17720
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000050.055500.00191
Tin solderTin (Sn)7440-31-50.0829599.940003.44367
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0057799.990000.23960
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.