Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTA144TM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTA144TMSOT883XQFN30.885795 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340582873151612601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.857986
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.118199
Phenolic resinProprietary0.00135313.5300000.152744
subTotal0.010000100.0000001.128929
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000006.773576
subTotal0.060000100.0000006.773576
Lead FrameCopper alloyCopper (Cu)7440-50-80.40166393.41000045.344916
Magnesium (Mg)7439-95-40.0006280.1460000.070874
Nickel (Ni)7440-02-00.0125262.9130001.414086
Silicon (Si)7440-21-30.0027130.6310000.306312
MetallisationGold (Au)7440-57-50.0001500.0350000.016990
Nickel (Ni)7440-02-00.0118462.7550001.337386
Palladium (Pd)7440-05-30.0004730.1100000.053398
subTotal0.430000100.00000048.543963
Mould CompoundFillerSilica -amorphous-7631-86-90.08510023.0000009.607189
Silica fused60676-86-00.22200060.00000025.062232
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0111003.0000001.253112
Ion trapping agentBismuth (Bi)7440-69-90.0018500.5000000.208852
PigmentCarbon black1333-86-40.0018500.5000000.208852
PolymerEpoxy resin systemProprietary0.0259007.0000002.923927
Phenolic resinProprietary0.0222006.0000002.506223
subTotal0.370000100.00000041.770387
Post-PlatingImpurityLead (Pb)7439-92-10.0000000.0045000.000051
Non hazardousProprietary0.0000060.0555000.000627
Tin solderTin (Sn)7440-31-50.00999499.9400001.128252
subTotal0.010000100.0000001.128929
WireImpurityNon hazardousProprietary0.0000010.0100000.000065
Pure metalGold (Au)7440-57-50.00579499.9900000.654149
subTotal0.005795100.0000000.654215
total0.885795100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.