Chemical content PDTB113ET

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Type numberPackagePackage descriptionTotal product weight
PDTB113ETSOT23TO-236AB7.80874 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340589782151512601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.21000100.000002.68929
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02938
Carbon (C)7440-44-00.001020.040000.01306
Chromium (Cr)7440-47-30.005610.220000.07181
Cobalt (Co)7440-48-40.010960.430000.14036
Iron (Fe)7439-89-61.2230147.9800015.66207
Manganese (Mn)7439-96-50.021920.860000.28073
Nickel (Ni)7440-02-00.9212136.1400011.79715
Phosphorus (P)7723-14-00.000510.020000.00653
Silicon (Si)7440-21-30.006630.260000.08487
Sulphur (S)7704-34-90.000510.020000.00653
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.71150
Silver (Ag)7440-22-40.065512.570000.83892
Mould CompoundFillerSilica fused60676-86-03.4449271.0000044.11621
PigmentCarbon black1333-86-40.014560.300000.18641
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9558419.7000012.24069
Phenolic resinProprietary0.436689.000005.59220
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000100.055500.00131
Tin solderTin (Sn)7440-31-50.1848999.940002.36772
WirePure metalGold (Au)7440-57-50.01274100.000000.16315
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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