Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTB143XQA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTB143XQASOT1215DFN1010D-31.210000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340692751472126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.02400080.0000001.983471
PolymerAcrylic resinProprietary0.00600020.0000000.495868
subTotal0.030000100.0000002.479339
DieDoped siliconSilicon (Si)7440-21-30.100000100.0000008.264463
subTotal0.100000100.0000008.264463
Lead FrameCopper alloyChromium (Cr)7440-47-30.0012720.2400000.105124
Copper (Cu)7440-50-80.50090394.51000041.396942
Tin (Sn)7440-31-50.0012720.2400000.105124
Zinc (Zn)7440-66-60.0011130.2100000.091983
Pure metal layerGold (Au)7440-57-50.0003710.0700000.030661
Nickel (Ni)7440-02-00.0229494.3300001.896612
Palladium (Pd)7440-05-30.0021200.4000000.175207
subTotal0.530000100.00000043.801653
Mould CompoundFillerSilica -amorphous-7631-86-90.11730023.0000009.694215
Silica fused60676-86-00.30600060.00000025.289256
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0153003.0000001.264463
Ion trapping agentBismuth (Bi)7440-69-90.0025500.5000000.210744
PigmentCarbon black1333-86-40.0025500.5000000.210744
PolymerEpoxy resin systemProprietary0.0357007.0000002.950413
Phenolic resinProprietary0.0306006.0000002.528926
subTotal0.510000100.00000042.148760
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000112
Non hazardousProprietary0.0000170.0555000.001376
Tin solderTin (Sn)7440-31-50.02998299.9400002.477851
subTotal0.030000100.0000002.479339
WireImpurityNon hazardousProprietary0.0000010.0100000.000083
Pure metalGold (Au)7440-57-50.00999999.9900000.826364
subTotal0.010000100.0000000.826446
total1.210000100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.