Chemical content PDTC123JQC-Q

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Type numberPackagePackage descriptionTotal product weight
PDTC123JQC-QSOT8009DFN1412D-32.47177 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934663502147212601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0053276.000000.21523
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0007310.470000.02965
Phenolic resinProprietary0.0009513.530000.03832
DieDoped siliconSilicon (Si)7440-21-30.02600100.000001.05188
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792044.07777
Magnesium (Mg)7439-95-40.001700.145400.06871
Nickel (Ni)7440-02-00.033982.908901.37456
Silicon (Si)7440-21-30.007360.630300.29784
Pure metal layerGold (Au)7440-57-50.000440.037300.01763
Nickel (Ni)7440-02-00.033552.872201.35722
Palladium (Pd)7440-05-30.001480.126700.05987
Mould CompoundAdditiveNon hazardousProprietary0.004850.410000.19606
FillerSilica -amorphous-7631-86-90.003430.290000.13868
Silica fused60676-86-01.0182986.1500041.19692
HardenerPhenolic resinProprietary0.050714.290002.05148
PigmentCarbon black1333-86-40.002250.190000.09086
PolymerEpoxy resin systemProprietary0.102488.670004.14599
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000050.055500.00186
Tin solderTin (Sn)7440-31-50.0829599.940003.35590
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0057799.990000.23349
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.