Chemical content PDTC124XMB

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Type numberPackagePackage descriptionTotal product weight
PDTC124XMBSOT883BXQFN30.71065 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340659413155126030 s123520 s3Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32083
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04420
Phenolic resinProprietary0.0004113.530000.05712
DieDoped siliconSilicon (Si)7440-21-30.06000100.000008.44297
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09456
Copper (Cu)7440-50-80.2632094.0000037.03652
Tin (Sn)7440-31-50.000670.240000.09456
Zinc (Zn)7440-66-60.000590.210000.08274
Pure metal layerGold (Au)7440-57-50.000220.080000.03152
Nickel (Ni)7440-02-00.013834.940001.94639
Palladium (Pd)7440-05-30.000810.290000.11426
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.00401
Silica fused60676-86-00.2040060.0000028.70611
Flame retardantMetal hydroxideProprietary0.010203.000001.43531
ImpurityBismuth (Bi)7440-69-90.001700.500000.23922
PigmentCarbon black1333-86-40.001700.500000.23922
PolymerEpoxy resin systemProprietary0.023807.000003.34905
Phenolic resinProprietary0.020406.000002.87061
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00156
Tin solderTin (Sn)7440-31-50.0199999.940002.81264
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0076599.990001.07629
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.