Chemical content PDTC124XQB-Q

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Type numberPackagePackage descriptionTotal product weight
PDTC124XQB-QSOT8015DFN1110D-31.61000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346634871472126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0045676.000000.28323
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0006310.470000.03902
Phenolic resinProprietary0.0008113.530000.05042
DieDoped siliconSilicon (Si)7440-21-30.05000100.000003.10559
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860044.64638
Magnesium (Mg)7439-95-40.001120.149000.06960
Nickel (Ni)7440-02-00.022422.980901.39232
Silicon (Si)7440-21-30.004860.645900.30169
Pure metal layerGold (Au)7440-57-50.000060.007700.00360
Nickel (Ni)7440-02-00.004470.594000.27745
Palladium (Pd)7440-05-30.000270.036500.01705
Mould CompoundAdditiveNon hazardousProprietary0.003050.410000.18972
FillerSilica -amorphous-7631-86-90.002160.290000.13419
Silica fused60676-86-00.6418286.1500039.86444
HardenerPhenolic resinProprietary0.031964.290001.98512
PigmentCarbon black1333-86-40.001420.190000.08792
PolymerEpoxy resin systemProprietary0.064598.670004.01189
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00196
Tin solderTin (Sn)7440-31-50.0569799.940003.53825
WireImpurityNon hazardousProprietaryNaN0.01000NaN
Pure metalCopper (Cu)7440-50-8NaN99.99000NaN
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.