Chemical content PDTC143EQB-Q

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Type numberPackagePackage descriptionTotal product weight
PDTC143EQB-QSOT8015DFN1110D-31.58600 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934663479147212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0045676.000000.28752
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0006310.470000.03961
Phenolic resinProprietary0.0008113.530000.05119
DieDoped siliconSilicon (Si)7440-21-30.02600100.000001.63934
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860045.32199
Magnesium (Mg)7439-95-40.001120.149000.07065
Nickel (Ni)7440-02-00.022422.980901.41339
Silicon (Si)7440-21-30.004860.645900.30625
Pure metal layerGold (Au)7440-57-50.000060.007700.00365
Nickel (Ni)7440-02-00.004470.594000.28164
Palladium (Pd)7440-05-30.000270.036500.01731
Mould CompoundAdditiveNon hazardousProprietary0.003050.410000.19259
FillerSilica -amorphous-7631-86-90.002160.290000.13622
Silica fused60676-86-00.6418286.1500040.46769
HardenerPhenolic resinProprietary0.031964.290002.01516
PigmentCarbon black1333-86-40.001420.190000.08925
PolymerEpoxy resin systemProprietary0.064598.670004.07260
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00199
Tin solderTin (Sn)7440-31-50.0569799.940003.59179
WireImpurityNon hazardousProprietaryNaN0.01000NaN
Pure metalCopper (Cu)7440-50-8NaN99.99000NaN
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.