Chemical content PDTC144EMB

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Type numberPackagePackage descriptionTotal product weight
PDTC144EMBSOT883BXQFN30.71023 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340659433155126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32102
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04423
Phenolic resinProprietary0.0004113.530000.05715
DieDoped siliconSilicon (Si)7440-21-30.06000100.000008.44797
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09462
Copper (Cu)7440-50-80.2632094.0000037.05842
Tin (Sn)7440-31-50.000670.240000.09462
Zinc (Zn)7440-66-60.000590.210000.08279
Pure metal layerGold (Au)7440-57-50.000220.080000.03154
Nickel (Ni)7440-02-00.013834.940001.94754
Palladium (Pd)7440-05-30.000810.290000.11433
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.01052
Silica fused60676-86-00.2040060.0000028.72309
Flame retardantMetal hydroxideProprietary0.010203.000001.43615
ImpurityBismuth (Bi)7440-69-90.001700.500000.23936
PigmentCarbon black1333-86-40.001700.500000.23936
PolymerEpoxy resin systemProprietary0.023807.000003.35103
Phenolic resinProprietary0.020406.000002.87231
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00156
Tin solderTin (Sn)7440-31-50.0199999.940002.81430
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0072399.990001.01853
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.