Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTC144WMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTC144WMBSOT883BXQFN30.710649 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065949315612601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.320833
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.044199
Phenolic resinProprietary0.00040613.5300000.057117
subTotal0.003000100.0000000.422149
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000008.442987
subTotal0.060000100.0000008.442987
Lead FrameCopper alloyChromium (Cr)7440-47-30.0006720.2400000.094561
Copper (Cu)7440-50-80.26320094.00000037.036568
Tin (Sn)7440-31-50.0006720.2400000.094561
Zinc (Zn)7440-66-60.0005880.2100000.082741
Pure metal layerGold (Au)7440-57-50.0002240.0800000.031520
Nickel (Ni)7440-02-00.0138324.9400001.946390
Palladium (Pd)7440-05-30.0008120.2900000.114262
subTotal0.280000100.00000039.400604
Mould CompoundFillerSilica -amorphous-7631-86-90.07820023.00000011.004026
Silica fused60676-86-00.20400060.00000028.706155
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0102003.0000001.435308
Ion trapping agentBismuth (Bi)7440-69-90.0017000.5000000.239218
PigmentCarbon black1333-86-40.0017000.5000000.239218
PolymerEpoxy resin systemProprietary0.0238007.0000003.349051
Phenolic resinProprietary0.0204006.0000002.870615
subTotal0.340000100.00000047.843591
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000127
Non hazardousProprietary0.0000110.0555000.001562
Tin solderTin (Sn)7440-31-50.01998899.9400002.812640
subTotal0.020000100.0000002.814329
WireImpurityNon hazardousProprietary0.0000010.0100000.000108
Pure metalGold (Au)7440-57-50.00764999.9900001.076289
subTotal0.007649100.0000001.076396
total0.710649100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.