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Chemical content PDZ10BGW

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Type numberPackagePackage descriptionTotal product weight
PDZ10BGWSOD123SOD212.05346 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934071042115112601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
934071042118112601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03000100.000000.24889
subTotal0.03000100.000000.24889
Lead FrameCopper alloyCopper (Cu)7440-50-83.5331894.4700029.31256
Iron (Fe)7439-89-60.077792.080000.64539
Phosphorus (P)7723-14-00.001500.040000.01241
Zinc (Zn)7440-66-60.004860.130000.04034
Pure metal layerCopper (Cu)7440-50-80.062461.670000.51817
Silver (Ag)7440-22-40.060211.610000.49956
subTotal3.74000100.0000031.02843
Mould CompoundAdditiveNon hazardousProprietary0.234032.900001.94160
Triphenylphosphine603-35-00.004040.050000.03348
FillerSilica -amorphous-7631-86-95.8104072.0000048.20525
PigmentCarbon black1333-86-40.004040.050000.03348
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2105015.0000010.04276
Phenol Formaldehyde resin (generic)9003-35-40.8070010.000006.69517
subTotal8.07000100.0000066.95174
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00008
Non hazardousProprietary0.000120.055500.00097
Tin solderTin (Sn)7440-31-50.2098799.940001.74119
subTotal0.21000100.000001.74224
WirePure metalCopper (Cu)7440-50-80.00346100.000000.02874
subTotal0.00346100.000000.02874
total12.05346100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.