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Chemical content PDZ5.6BGW

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Type numberPackagePackage descriptionTotal product weight
PDZ5.6BGWSOD123SOD212.07346 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934071089118112601235D-22529 HAMBURG, Germany; Dongguan, China 
934071089115112601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000000.41413
subTotal0.05000100.000000.41413
Lead FrameCopper alloyCopper (Cu)7440-50-83.5331894.4700029.26401
Iron (Fe)7439-89-60.077792.080000.64432
Phosphorus (P)7723-14-00.001500.040000.01239
Zinc (Zn)7440-66-60.004860.130000.04027
Pure metal layerCopper (Cu)7440-50-80.062461.670000.51732
Silver (Ag)7440-22-40.060211.610000.49873
subTotal3.74000100.0000030.97704
Mould CompoundAdditiveNon hazardousProprietary0.234032.900001.93838
Triphenylphosphine603-35-00.004040.050000.03342
FillerSilica -amorphous-7631-86-95.8104072.0000048.12539
PigmentCarbon black1333-86-40.004040.050000.03342
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2105015.0000010.02612
Phenol Formaldehyde resin (generic)9003-35-40.8070010.000006.68408
subTotal8.07000100.0000066.84081
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00008
Non hazardousProprietary0.000120.055500.00097
Tin solderTin (Sn)7440-31-50.2098799.940001.73831
subTotal0.21000100.000001.73936
WirePure metalCopper (Cu)7440-50-80.00346100.000000.02869
subTotal0.00346100.000000.02869
total12.07346100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.