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Chemical content PEMH16

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Type numberPackagePackage descriptionTotal product weight
PEMH16SOT666SOT62.82865 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340589291151412601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.12000100.000004.24231
subTotal
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.000930.080000.03281
Silicon (Si)7440-21-30.002900.250000.10252
Iron (Fe)7439-89-60.5417246.7000019.15119
Phosphorus (P)7723-14-00.000230.020000.00820
Manganese (Mn)7439-96-50.009740.840000.34448
Cobalt (Co)7440-48-40.004870.420000.17224
Sulphur (S)7704-34-90.000230.020000.00820
Chromium (Cr)7440-47-30.002440.210000.08612
Nickel (Ni)7440-02-00.4080935.1800014.42695
Carbon (C)7440-44-00.000460.040000.01640
Pure metal layerCopper (Cu)7440-50-80.1497612.910005.29426
Silver (Ag)7440-22-40.038633.330001.36560
subTotal
Mould CompoundFillerSilica fused60676-86-01.0426271.0000036.85931
PigmentCarbon black1333-86-40.004410.300000.15574
PolymerPhenolic resinProprietary0.132169.000004.67231
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.2892919.7000010.22716
subTotal
Post-PlatingImpurityCopper (Cu)7440-50-80.000000.001000.00002
Bismuth (Bi)7440-69-90.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00011
Antimony (Sb)7440-36-00.000000.003000.00007
Tin solderTin (Sn)7440-31-50.0636999.990002.25173
subTotal
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalGold (Au)7440-57-50.0164799.990000.58220
subTotal
total2.82865100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.