Chemical content PESD12VS1ULD

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Type numberPackagePackage descriptionTotal product weight
PESD12VS1ULDSOD882DDFN1006-20.69064 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934065311315512601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33013
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04548
Phenolic resinProprietary0.0004113.530000.05877
DieDoped siliconSilicon (Si)7440-21-30.05000100.000007.23966
Lead FrameCopper alloyChromium (Cr)7440-47-30.000800.257500.11633
Copper (Cu)7440-50-80.2957694.7950042.82411
Tin (Sn)7440-31-50.000750.238800.10788
Zinc (Zn)7440-66-60.000600.190800.08619
Pure metal layerGold (Au)7440-57-50.000170.055000.02485
Nickel (Ni)7440-02-00.013394.292001.93893
Palladium (Pd)7440-05-30.000530.170900.07720
Mould CompoundFillerSilica -amorphous-7631-86-90.0687723.000009.95743
Silica fused60676-86-00.1794060.0000025.97591
Flame retardantMetal hydroxideProprietary0.008973.000001.29880
ImpurityBismuth (Bi)7440-69-90.001500.500000.21647
PigmentCarbon black1333-86-40.001500.500000.21647
PolymerEpoxy resin systemProprietary0.020937.000003.03052
Phenolic resinProprietary0.017946.000002.59759
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00014
Non hazardousProprietary0.000010.055500.00177
Tin solderTin (Sn)7440-31-50.0219999.940003.18354
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0046499.990000.67177
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.