Chemical content PESD12VS1ULS

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Type numberPackagePackage descriptionTotal product weight
PESD12VS1ULSSOD882BDDFN1006-20.89640 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346617163152126030 s123520 s3Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.61089
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22192
Phenolic resinProprietary0.0025713.530000.28678
DieDoped siliconSilicon (Si)7440-21-30.03500100.000003.90451
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000042.12628
Magnesium (Mg)7439-95-40.000590.150000.06610
Nickel (Ni)7440-02-00.011772.980001.31314
Silicon (Si)7440-21-30.002570.650000.28642
Pure metal layerGold (Au)7440-57-50.000040.010000.00441
Nickel (Ni)7440-02-00.002250.570000.25117
Palladium (Pd)7440-05-30.000160.040000.01763
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.76566
Silica fused60676-86-00.3387980.0920037.79442
PigmentCarbon black1333-86-40.003930.928000.43791
PolymerEpoxy resin systemProprietary0.035748.450003.98745
Phenolic resinProprietary0.010792.550001.20331
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00124
Tin solderTin (Sn)7440-31-50.0199999.940002.22981
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0044099.990000.49080
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.