Chemical content PESD18VF1BL-Q

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Type numberPackagePackage descriptionTotal product weight
PESD18VF1BL-QSOD882DFN1006-20.93396 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934663865315212601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.81374
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11210
Phenolic resinProprietary0.0013513.530000.14487
DieDoped siliconSilicon (Si)7440-21-30.04000100.000004.28284
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.48026
Magnesium (Mg)7439-95-40.000820.200000.08780
Nickel (Ni)7440-02-00.012923.150001.38282
Silicon (Si)7440-21-30.002830.690000.30290
Pure metal layerGold (Au)7440-57-50.000120.030000.01317
Nickel (Ni)7440-02-00.005211.270000.55752
Palladium (Pd)7440-05-30.000700.170000.07463
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.08185
Silica fused60676-86-00.2700060.0000028.90916
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.013503.000001.44546
Ion trapping agentBismuth (Bi)7440-69-90.002250.500000.24091
PigmentCarbon black1333-86-40.002250.500000.24091
PolymerEpoxy resin systemProprietary0.031507.000003.37274
Phenolic resinProprietary0.027006.000002.89092
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00119
Tin solderTin (Sn)7440-31-50.0199999.940002.14013
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0039699.990000.42449
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.