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Chemical content PESD1ETH1GXLS-Q

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Type numberPackagePackage descriptionTotal product weight
PESD1ETH1GXLS-QSOD882BDDFN1006-20.92803 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663541315412601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0174876.000001.88356
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0024110.470000.25949
Phenolic resinProprietary0.0031113.530000.33532
subTotal0.02300100.000002.47837
DieDoped siliconSilicon (Si)7440-21-30.06400100.000006.89633
subTotal0.06400100.000006.89633
Lead FrameCopper alloyCopper (Cu)7440-50-80.3825295.6300041.21850
Magnesium (Mg)7439-95-40.000600.150000.06465
Nickel (Ni)7440-02-00.011922.980001.28444
Silicon (Si)7440-21-30.002600.650000.28016
Pure metal layerGold (Au)7440-57-50.000040.010000.00431
Nickel (Ni)7440-02-00.002200.550000.23706
Palladium (Pd)7440-05-30.000120.030000.01293
subTotal0.40000100.0000043.10205
Mould CompoundFillerSilica -amorphous-7631-86-90.032407.980003.49114
Silica fused60676-86-00.3251780.0920035.03912
PigmentCarbon black1333-86-40.003770.928000.40599
PolymerEpoxy resin systemProprietary0.034318.450003.69676
Phenolic resinProprietary0.010352.550001.11559
subTotal0.40600100.0000043.74860
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000020.055500.00185
Tin solderTin (Sn)7440-31-50.0309899.940003.33841
subTotal0.03100100.000003.34041
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0040399.990000.43378
subTotal0.00403100.000000.43382
total0.92803100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.