Chemical content PESD1IVN24L-Q

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Type numberPackagePackage descriptionTotal product weight
PESD1IVN24L-QSOD882DFN1006-20.93980 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934665821315112601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.80868
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11141
Phenolic resinProprietary0.0013513.530000.14397
DieDoped siliconSilicon (Si)7440-21-30.04600100.000004.89466
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.22249
Magnesium (Mg)7439-95-40.000820.200000.08725
Nickel (Ni)7440-02-00.012923.150001.37423
Silicon (Si)7440-21-30.002830.690000.30102
Pure metal layerGold (Au)7440-57-50.000120.030000.01309
Nickel (Ni)7440-02-00.005211.270000.55405
Palladium (Pd)7440-05-30.000700.170000.07416
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.01298
Silica fused60676-86-00.2700060.0000028.72952
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.013503.000001.43648
Ion trapping agentBismuth (Bi)7440-69-90.002250.500000.23941
PigmentCarbon black1333-86-40.002250.500000.23941
PolymerEpoxy resin systemProprietary0.031507.000003.35178
Phenolic resinProprietary0.027006.000002.87295
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00118
Tin solderTin (Sn)7440-31-50.0199999.940002.12684
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0038499.990000.40856
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.