Chemical content PESD1IVN27-A

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Type numberPackagePackage descriptionTotal product weight
PESD1IVN27-ASOD323SOD24.50372 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934660121115712601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07000100.000001.55427
Lead FrameCopper alloyCopper (Cu)7440-50-81.2422597.8150027.58276
Iron (Fe)7439-89-60.025532.010000.56680
Phosphorus (P)7723-14-00.000410.032000.00902
Zinc (Zn)7440-66-60.001460.115000.03243
Pure metal layerCopper (Cu)7440-50-80.000060.005000.00141
Silver (Ag)7440-22-40.000290.023000.00649
Mould CompoundAdditiveNon hazardousProprietary0.088452.900001.96393
FillerSilica -amorphous-7631-86-92.1960072.0000048.75969
PigmentCarbon black1333-86-40.001520.050000.03386
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4575015.0000010.15827
Phenol Formaldehyde resin (generic)9003-35-40.3050010.000006.77218
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000060.055500.00136
Tin solderTin (Sn)7440-31-50.1099399.940002.44096
WirePure metalCopper (Cu)7440-50-80.00372100.000000.08271
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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