×

Chemical content PESD2CANFD24UQC-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD2CANFD24UQC-QSOT8009DFN1412D-32.47288 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346660441471126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0045676.000000.18440
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0006310.470000.02540
Phenolic resinProprietary0.0008113.530000.03283
subTotal0.00600100.000000.24263
DieDoped siliconSilicon (Si)7440-21-30.04900100.000001.98150
subTotal0.04900100.000001.98150
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792044.05798
Magnesium (Mg)7439-95-40.001700.145400.06868
Nickel (Ni)7440-02-00.033982.908901.37394
Silicon (Si)7440-21-30.007360.630300.29771
Pure metal layerGold (Au)7440-57-50.000440.037300.01762
Nickel (Ni)7440-02-00.033552.872201.35661
Palladium (Pd)7440-05-30.001480.126700.05984
subTotal1.16800100.0000047.23238
Mould CompoundAdditiveNon hazardousProprietary0.004740.410000.19166
FillerSilica -amorphous-7631-86-90.003350.290000.13557
Silica fused60676-86-00.9958986.1500040.27264
HardenerPhenolic resinProprietary0.049594.290002.00545
PigmentCarbon black1333-86-40.002200.190000.08882
PolymerEpoxy resin systemProprietary0.100238.670004.05297
subTotal1.15600100.0000046.74711
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000050.055500.00186
Tin solderTin (Sn)7440-31-50.0829599.940003.35440
subTotal0.08300100.000003.35641
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0108899.990000.43993
subTotal0.01088100.000000.43997
total2.47288100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.