Chemical content PESD2CANFD24V-QB

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Type numberPackagePackage descriptionTotal product weight
PESD2CANFD24V-QBSOT8015DFN1110D-31.61388 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934661608147212601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0045676.000000.28255
PolymerPhenolic resinProprietary0.0008113.530000.05030
Formaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0006310.470000.03892
DieDoped siliconSilicon (Si)7440-21-30.04900100.000003.03616
Lead FrameCopper alloySilicon (Si)7440-21-30.004860.645900.30096
Magnesium (Mg)7439-95-40.001120.149000.06943
Copper (Cu)7440-50-80.7188195.5860044.53904
Nickel (Ni)7440-02-00.022422.980901.38897
Pure metal layerGold (Au)7440-57-50.000060.007700.00359
Nickel (Ni)7440-02-00.004470.594000.27678
Palladium (Pd)7440-05-30.000270.036500.01701
Mould CompoundAdditiveNon hazardousProprietary0.003030.410000.18774
FillerSilica fused60676-86-00.6366586.1500039.44832
Silica -amorphous-7631-86-90.002140.290000.13279
HardenerPhenolic resinProprietary0.031704.290001.96440
PigmentCarbon black1333-86-40.001400.190000.08700
PolymerEpoxy resin systemProprietary0.064078.670003.97002
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00196
Tin solderTin (Sn)7440-31-50.0569799.940003.52974
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0108899.990000.67408
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.