Chemical content PESD2CANFD36VQC-Q

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Type numberPackagePackage descriptionTotal product weight
PESD2CANFD36VQC-QSOT8009DFN1412D-32.44972 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934665549147312601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0106476.000000.43434
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0014710.470000.05984
Phenolic resinProprietary0.0018913.530000.07732
DieDoped siliconSilicon (Si)7440-21-30.07000100.000002.85747
Lead FrameCopper alloyCopper (Cu)7440-50-81.0895093.2792044.47451
Magnesium (Mg)7439-95-40.001700.145400.06933
Nickel (Ni)7440-02-00.033982.908901.38693
Silicon (Si)7440-21-30.007360.630300.30052
Pure metal layerGold (Au)7440-57-50.000440.037300.01778
Nickel (Ni)7440-02-00.033552.872201.36943
Palladium (Pd)7440-05-30.001480.126700.06041
Mould CompoundFillerSilica -amorphous-7631-86-90.088747.980003.62236
Silica fused60676-86-00.8906280.0920036.35612
PigmentCarbon black1333-86-40.010320.928000.42125
PolymerEpoxy resin systemProprietary0.093968.450003.83570
Phenolic resinProprietary0.028362.550001.15752
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000050.055500.00188
Tin solderTin (Sn)7440-31-50.0829599.940003.38611
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0027299.990000.11100
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.