Chemical content PESD2ETH1G-T

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Type numberPackagePackage descriptionTotal product weight
PESD2ETH1G-TSOT23TO-236AB7.92322 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934661104215212601235Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.15600100.000001.96890
DieDoped siliconSilicon (Si)7440-21-30.14700100.000001.85531
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02895
Carbon (C)7440-44-00.001020.040000.01287
Chromium (Cr)7440-47-30.005610.220000.07078
Cobalt (Co)7440-48-40.010960.430000.13834
Iron (Fe)7439-89-61.2230147.9800015.43577
Manganese (Mn)7439-96-50.021920.860000.27667
Nickel (Ni)7440-02-00.9212136.1400011.62669
Phosphorus (P)7723-14-00.000510.020000.00643
Silicon (Si)7440-21-30.006630.260000.08365
Sulphur (S)7704-34-90.000510.020000.00643
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.65787
Silver (Ag)7440-22-40.065512.570000.82680
Mould CompoundFillerSilica fused60676-86-03.4449271.0000043.47879
PigmentCarbon black1333-86-40.014560.300000.18371
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9558419.7000012.06383
Phenolic resinProprietary0.436689.000005.51140
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00007
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000010.005000.00012
Tin solderTin (Sn)7440-31-50.1849899.990002.33468
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0342299.990000.43190
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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