Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD2ETHAX-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD2ETHAX-QSOT143BSOT48.93806 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346629752151126030 s123520 s3Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.14000100.000001.56634
subTotal0.14000100.000001.56634
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.003020.090000.03373
Carbon (C)7440-44-00.001340.040000.01499
Chromium (Cr)7440-47-30.007040.210000.07871
Cobalt (Co)7440-48-40.014070.420000.15742
Iron (Fe)7439-89-61.5838847.2800017.72062
Manganese (Mn)7439-96-50.028480.850000.31858
Nickel (Ni)7440-02-01.1932735.6200013.35044
Phosphorus (P)7723-14-00.000670.020000.00750
Silicon (Si)7440-21-30.008380.250000.09370
Sulphur (S)7704-34-90.000670.020000.00750
Pure metal layerCopper (Cu)7440-50-80.4381813.080004.90241
Silver (Ag)7440-22-40.071022.120000.79458
subTotal3.35000100.0000037.48018
Mould CompoundFillerSilica fused60676-86-03.5216071.0000039.40005
PigmentCarbon black1333-86-40.014880.300000.16648
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9771219.7000010.93213
Phenolic resinProprietary0.446409.000004.99437
subTotal4.96000100.0000055.49303
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00024
Non hazardousProprietary0.000260.055500.00292
Tin solderTin (Sn)7440-31-50.4697299.940005.25526
subTotal0.47000100.000005.25842
WirePure metalGold (Au)7440-57-50.01806100.000000.20206
subTotal0.01806100.000000.20206
total8.93806100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.