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Chemical content PESD3V3L4BHC

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Type numberPackagePackage descriptionTotal product weight
PESD3V3L4BHCSOT8006DFN1308-61.15443 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660987315512601235Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0103545.000000.89655
PolymerAcrylic resinProprietary0.0034515.000000.29885
Phenolic resinProprietary0.0034515.000000.29885
Resin systemProprietary0.0057525.000000.49808
subTotal0.02300100.000001.99233
DieDoped siliconSilicon (Si)7440-21-30.06100100.000005.28399
subTotal0.06100100.000005.28399
Lead FrameCopper alloyCopper (Cu)7440-50-80.2127396.6970018.42757
Magnesium (Mg)7439-95-40.000110.050000.00953
Silicon (Si)7440-21-30.000550.248000.04726
ImpurityNon hazardousProprietary0.000000.000300.00006
Pure metal layerGold (Au)7440-57-50.000020.010000.00191
Nickel (Ni)7440-02-00.006542.974700.56689
Palladium (Pd)7440-05-30.000040.020000.00381
subTotal0.22000100.0000019.05703
Mould CompoundFillerSilica -amorphous-7631-86-90.058037.000005.02672
Silica fused60676-86-00.6880783.0000059.60257
PigmentCarbon black1333-86-40.004140.500000.35905
PolymerEpoxy resin systemProprietary0.049746.000004.30862
Phenolic resinProprietary0.029023.500002.51336
subTotal0.82900100.0000071.81032
WireImpurityBeryllium (Be)7440-41-70.000000.010000.00019
Pure metalGold (Au)7440-57-50.0214399.990001.85620
subTotal0.02143100.000001.85639
total1.15443100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.