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Chemical content PESD3V3S1BL

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Type numberPackagePackage descriptionTotal product weight
PESD3V3S1BLSOD882DFN1006-20.94480 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934071029315112601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.80440
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11082
Phenolic resinProprietary0.0013513.530000.14320
subTotal0.01000100.000001.05842
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.29213
subTotal0.05000100.000005.29213
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.00434
Magnesium (Mg)7439-95-40.000820.200000.08679
Nickel (Ni)7440-02-00.012923.150001.36696
Silicon (Si)7440-21-30.002830.690000.29943
Pure metal layerGold (Au)7440-57-50.000120.030000.01302
Nickel (Ni)7440-02-00.005211.270000.55112
Palladium (Pd)7440-05-30.000700.170000.07377
subTotal0.41000100.0000043.39543
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000010.95470
Silica fused60676-86-00.2700060.0000028.57748
Flame retardantMetal hydroxideProprietary0.013503.000001.42887
ImpurityBismuth (Bi)7440-69-90.002250.500000.23815
PigmentCarbon black1333-86-40.002250.500000.23815
PolymerEpoxy resin systemProprietary0.031507.000003.33404
Phenolic resinProprietary0.027006.000002.85775
subTotal0.45000100.0000047.62914
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00117
Tin solderTin (Sn)7440-31-50.0199999.940002.11558
subTotal0.02000100.000002.11685
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0048099.990000.50799
subTotal0.00480100.000000.50804
total0.94480100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.