Chemical content PESD3V3S2UQ

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type number	Package	Package description	Total product weight
PESD3V3S2UQ	SOT663	SOT3	2.52536 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934057839115	13	1	260	30 s	1	235	20 s	3	D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	0.10000	100.00000	3.95983
		subTotal		0.10000	100.00000	3.95983

Lead Frame	Iron-nickel alloy	Aluminium (Al)	7429-90-5	0.00076	0.08000	0.03009
		Carbon (C)	7440-44-0	0.00038	0.04000	0.01505
		Chromium (Cr)	7440-47-3	0.00200	0.21000	0.07900
		Cobalt (Co)	7440-48-4	0.00399	0.42000	0.15800
		Iron (Fe)	7439-89-6	0.44384	46.72000	17.57532
		Manganese (Mn)	7439-96-5	0.00798	0.84000	0.31599
		Nickel (Ni)	7440-02-0	0.33440	35.20000	13.24168
		Phosphorus (P)	7723-14-0	0.00019	0.02000	0.00752
		Silicon (Si)	7440-21-3	0.00238	0.25000	0.09405
		Sulphur (S)	7704-34-9	0.00019	0.02000	0.00752
	Pure metal layer	Copper (Cu)	7440-50-8	0.12274	12.92000	4.86030
		Silver (Ag)	7440-22-4	0.03116	3.28000	1.23388
		subTotal		0.95000	100.00000	37.61840

Mould Compound	Filler	Silica fused	60676-86-0	1.00820	71.00000	39.92302
	Pigment	Carbon black	1333-86-4	0.00426	0.30000	0.16869
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	0.27974	19.70000	11.07723
		Phenolic resin	Proprietary	0.12780	9.00000	5.06066
		subTotal		1.42000	100.00000	56.22960

Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.00000	0.00300	0.00005
		Bismuth (Bi)	7440-69-9	0.00000	0.00100	0.00002
		Copper (Cu)	7440-50-8	0.00000	0.00100	0.00002
		Lead (Pb)	7439-92-1	0.00000	0.00500	0.00009
	Tin solder	Tin (Sn)	7440-31-5	0.04400	99.99000	1.74215
		subTotal		0.04400	100.00000	1.74233

Wire	Impurity	Non hazardous	Proprietary	0.00000	0.01000	0.00004
	Pure metal	Gold (Au)	7440-57-5	0.01136	99.99000	0.44979
		subTotal		0.01136	100.00000	0.44983

		total		2.52536	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

China RoHS Information

Name of the part 部件名称	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
Die 晶粒	O	O	O	O	O	O
Lead Frame 引线框	O	O	O	O	O	O
Mould Compound 注塑胶料	O	O	O	O	O	O
Post-Plating 后电镀	O	O	O	O	O	O
Wire 线	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

Remark: All Nexperia products have an environmental friendly use period (EFUP) of 50 years.

disclaimer 免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

disclaimer
免责声明

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.