Chemical content PESD3V3T1BL-Q

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Type numberPackagePackage descriptionTotal product weight
PESD3V3T1BL-QSOD882DFN1006-20.91408 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934665508315112601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.83144
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11454
Phenolic resinProprietary0.0013513.530000.14802
DieDoped siliconSilicon (Si)7440-21-30.02000100.000002.18799
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900042.38240
Magnesium (Mg)7439-95-40.000820.200000.08971
Nickel (Ni)7440-02-00.012923.150001.41290
Silicon (Si)7440-21-30.002830.690000.30949
Pure metal layerGold (Au)7440-57-50.000120.030000.01346
Nickel (Ni)7440-02-00.005211.270000.56964
Palladium (Pd)7440-05-30.000700.170000.07625
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.32286
Silica fused60676-86-00.2700060.0000029.53790
Flame retardantMetal hydroxideProprietary0.013503.000001.47689
ImpurityBismuth (Bi)7440-69-90.002250.500000.24615
PigmentCarbon black1333-86-40.002250.500000.24615
PolymerEpoxy resin systemProprietary0.031507.000003.44609
Phenolic resinProprietary0.027006.000002.95379
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00121
Tin solderTin (Sn)7440-31-50.0199999.940002.18668
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0040899.990000.44631
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.