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Chemical content PESD3V3X1BL

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Type numberPackagePackage descriptionTotal product weight
PESD3V3X1BLSOD882DFN1006-20.95305 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340632653151112601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.79744
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.10986
Phenolic resinProprietary0.0013513.530000.14197
subTotal0.01000100.000001.04927
DieDoped siliconSilicon (Si)7440-21-30.06000100.000006.29558
subTotal0.06000100.000006.29558
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900040.64939
Magnesium (Mg)7439-95-40.000820.200000.08604
Nickel (Ni)7440-02-00.012923.150001.35512
Silicon (Si)7440-21-30.002830.690000.29684
Pure metal layerGold (Au)7440-57-50.000120.030000.01291
Nickel (Ni)7440-02-00.005211.270000.54635
Palladium (Pd)7440-05-30.000700.170000.07313
subTotal0.41000100.0000043.01978
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000010.85987
Silica fused60676-86-00.2700060.0000028.33010
Flame retardantMetal hydroxideProprietary0.013503.000001.41650
ImpurityBismuth (Bi)7440-69-90.002250.500000.23608
PigmentCarbon black1333-86-40.002250.500000.23608
PolymerEpoxy resin systemProprietary0.031507.000003.30518
Phenolic resinProprietary0.027006.000002.83301
subTotal0.45000100.0000047.21682
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00116
Tin solderTin (Sn)7440-31-50.0199999.940002.09727
subTotal0.02000100.000002.09852
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalGold (Au)7440-57-50.0030599.990000.31999
subTotal0.00305100.000000.32002
total0.95305100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.