Chemical content PESD4USB3UTBS-Q

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Type numberPackagePackage descriptionTotal product weight
PESD4USB3UTBS-QSOT1176DDFN2510D5.20400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934666099118212601235Nijmegen, Netherlands; Bangkok, Thailand; D-22529 HAMBURG, Germany 
934666099115412601235Nijmegen, Netherlands; D-22529 HAMBURG, Germany; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0450045.000000.86472
PolymerAcrylic resinProprietary0.0150015.000000.28824
Phenolic resinProprietary0.0150015.000000.28824
Resin systemProprietary0.0250025.000000.48040
DieDoped siliconSilicon (Si)7440-21-30.09900100.000001.90238
Lead FrameCopper alloyCopper (Cu)7440-50-81.9168295.8412036.83367
Iron (Fe)7439-89-60.051942.596970.99807
Phosphorus (P)7723-14-00.003000.149830.05758
Zinc (Zn)7440-66-60.004000.199770.07678
ImpurityLead (Pb)7439-92-10.000060.002800.00108
Pure metal layerSilver (Ag)7440-22-40.024191.209450.46482
Mould CompoundFillerSilica -amorphous-7631-86-90.154007.000002.95926
Silica fused60676-86-01.8260083.0000035.08839
PigmentCarbon black1333-86-40.011000.500000.21138
PolymerEpoxy resin systemProprietary0.132006.000002.53651
Phenolic resinProprietary0.077003.500001.47963
Post-PlatingImpurityNon hazardousProprietary0.000800.100000.01537
Tin solderTin (Sn)7440-31-50.7992099.9000015.35742
WirePure metalGold (Au)7440-57-50.0049599.000000.09512
Palladium (Pd)7440-05-30.000051.000000.00096
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.