×

Chemical content PESD4USB5UBTBR-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD4USB5UBTBR-QSOT1176-2XSON103.34544 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93466506747141260NA235Nijmegen, Netherlands; D-22529 HAMBURG, Germany; Bangkok, Thailand; Xian, China; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0315045.000000.94158
PolymerAcrylic resinProprietary0.0105015.000000.31386
Phenolic resinProprietary0.0105015.000000.31386
Resin systemProprietary0.0175025.000000.52310
subTotal0.07000100.000002.09240
DieDoped siliconSilicon (Si)7440-21-30.05500100.000001.64403
subTotal0.05500100.000001.64403
Lead FrameCopper alloyCopper (Cu)7440-50-80.8986094.5900026.86059
Magnesium (Mg)7439-95-40.001620.170000.04827
Nickel (Ni)7440-02-00.041044.320001.22674
Silicon (Si)7440-21-30.006740.710000.20162
Pure metal layerGold (Au)7440-57-50.000280.030000.00852
Nickel (Ni)7440-02-00.001040.110000.03124
Palladium (Pd)7440-05-30.000480.050000.01420
Silver (Ag)7440-22-40.000190.020000.00568
subTotal0.95000100.0000028.39686
Mould CompoundFillerSilica -amorphous-7631-86-90.157507.000004.70790
Silica fused60676-86-01.8675083.0000055.82225
PigmentCarbon black1333-86-40.011250.500000.33628
PolymerEpoxy resin systemProprietary0.135006.000004.03534
Phenolic resinProprietary0.078753.500002.35395
subTotal2.25000100.0000067.25572
WireImpurityNon hazardousProprietary0.000000.000050.00000
Silver (Ag)7440-22-40.000000.001450.00001
Pure metalCopper (Cu)7440-50-80.0197396.548550.58984
Pure metal layerGold (Au)7440-57-50.000090.449960.00275
Palladium (Pd)7440-05-30.000612.999700.01833
subTotal0.02044100.000000.61093
total3.34544100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.