Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD4USB5UTTS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD4USB5UTTS-QSOT1165DDFN2510D5.20400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934666097115412601235Nijmegen, Netherlands; D-22529 HAMBURG, Germany; Bangkok, Thailand 
934666097118212601235Bangkok, Thailand; D-22529 HAMBURG, Germany; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0450045.000000.86472
PolymerAcrylic resinProprietary0.0150015.000000.28824
Phenolic resinProprietary0.0150015.000000.28824
Resin systemProprietary0.0250025.000000.48040
subTotal0.10000100.000001.92160
DieDoped siliconSilicon (Si)7440-21-30.09900100.000001.90238
subTotal0.09900100.000001.90238
Lead FrameCopper alloyCopper (Cu)7440-50-81.7726688.6330034.06341
Iron (Fe)7439-89-60.041402.070000.79554
Phosphorus (P)7723-14-00.000540.027000.01038
Zinc (Zn)7440-66-60.002700.135000.05188
Pure metal layerSilver (Ag)7440-22-40.182709.135003.51076
subTotal2.00000100.0000038.43197
Mould CompoundFillerSilica -amorphous-7631-86-90.154007.000002.95926
Silica fused60676-86-01.8260083.0000035.08839
PigmentCarbon black1333-86-40.011000.500000.21138
PolymerEpoxy resin systemProprietary0.132006.000002.53651
Phenolic resinProprietary0.077003.500001.47963
subTotal2.20000100.0000042.27517
Post-PlatingImpurityNon hazardousProprietary0.000800.100000.01537
Tin solderTin (Sn)7440-31-50.7992099.9000015.35742
subTotal0.80000100.0000015.37279
WirePure metalGold (Au)7440-57-50.0049599.000000.09512
Palladium (Pd)7440-05-30.000051.000000.00096
subTotal0.00500100.000000.09608
total5.20400100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.