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Chemical content PESD4V0X2UM

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Type numberPackagePackage descriptionTotal product weight
PESD4V0X2UMSOT883-3XQFN30.80905 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662646305312601235D-22529 HAMBURG, Germany; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0045045.000000.55621
PolymerAcrylic resinProprietary0.0015015.000000.18540
Phenolic resinProprietary0.0015015.000000.18540
Resin systemProprietary0.0025025.000000.30900
subTotal0.01000100.000001.23601
DieDoped siliconSilicon (Si)7440-21-30.05400100.000006.67449
subTotal0.05400100.000006.67449
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-80.1746097.0000021.58087
Nickel (Ni)7440-02-00.005403.000000.66745
subTotal0.18000100.0000022.24832
Mould CompoundFillerSilica -amorphous-7631-86-90.038507.000004.75867
Silica fused60676-86-00.4565083.0000056.42420
PigmentCarbon black1333-86-40.002750.500000.33990
PolymerEpoxy resin systemProprietary0.033006.000004.07886
Phenolic resinProprietary0.019253.500002.37933
subTotal0.55000100.0000067.98096
Pre-PlatingPure metal layerGold (Au)7440-57-50.000101.000000.01236
Nickel (Ni)7440-02-00.0091091.000001.12478
Palladium (Pd)7440-05-30.000808.000000.09888
subTotal0.01000100.000001.23602
WireImpurityBeryllium (Be)7440-41-70.000000.010000.00006
Pure metalGold (Au)7440-57-50.0050599.990000.62471
subTotal0.00505100.000000.62477
total0.80905100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.