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Chemical content PESD5V0G1BL

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Type numberPackagePackage descriptionTotal product weight
PESD5V0G1BLSOD882DFN1006-20.91424 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067955315412601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.83129
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11452
Phenolic resinProprietary0.0013513.530000.14799
subTotal0.01000100.000001.09380
DieDoped siliconSilicon (Si)7440-21-30.02000100.000002.18761
subTotal0.02000100.000002.18761
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900042.37498
Magnesium (Mg)7439-95-40.000820.200000.08969
Nickel (Ni)7440-02-00.012923.150001.41265
Silicon (Si)7440-21-30.002830.690000.30944
Pure metal layerGold (Au)7440-57-50.000120.030000.01345
Nickel (Ni)7440-02-00.005211.270000.56954
Palladium (Pd)7440-05-30.000700.170000.07624
subTotal0.41000100.0000044.84599
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.32088
Silica fused60676-86-00.2700060.0000029.53273
Flame retardantMetal hydroxideProprietary0.013503.000001.47664
ImpurityBismuth (Bi)7440-69-90.002250.500000.24611
PigmentCarbon black1333-86-40.002250.500000.24611
PolymerEpoxy resin systemProprietary0.031507.000003.44548
Phenolic resinProprietary0.027006.000002.95327
subTotal0.45000100.0000049.22122
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00121
Tin solderTin (Sn)7440-31-50.0199999.940002.18630
subTotal0.02000100.000002.18761
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0042499.990000.46373
subTotal0.00424100.000000.46378
total0.91424100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.