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Chemical content PESD5V0L1ULD

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Type numberPackagePackage descriptionTotal product weight
PESD5V0L1ULDSOD882DDFN1006-20.67064 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065313315512601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33997
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04684
Phenolic resinProprietary0.0004113.530000.06052
subTotal0.00300100.000000.44733
DieDoped siliconSilicon (Si)7440-21-30.03000100.000004.47334
subTotal0.03000100.000004.47334
Lead FrameCopper alloyChromium (Cr)7440-47-30.000800.257500.11980
Copper (Cu)7440-50-80.2957694.7950044.10122
Tin (Sn)7440-31-50.000750.238800.11110
Zinc (Zn)7440-66-60.000600.190800.08877
Pure metal layerGold (Au)7440-57-50.000170.055000.02559
Nickel (Ni)7440-02-00.013394.292001.99676
Palladium (Pd)7440-05-30.000530.170900.07951
subTotal0.31200100.0000046.52275
Mould CompoundFillerSilica -amorphous-7631-86-90.0687723.0000010.25438
Silica fused60676-86-00.1794060.0000026.75057
Flame retardantMetal hydroxideProprietary0.008973.000001.33753
ImpurityBismuth (Bi)7440-69-90.001500.500000.22292
PigmentCarbon black1333-86-40.001500.500000.22292
PolymerEpoxy resin systemProprietary0.020937.000003.12090
Phenolic resinProprietary0.017946.000002.67506
subTotal0.29900100.0000044.58428
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000010.055500.00182
Tin solderTin (Sn)7440-31-50.0219999.940003.27848
subTotal0.02200100.000003.28045
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0046499.990000.69181
subTotal0.00464100.000000.69188
total0.67064100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.