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Chemical content PESD5V0S1BA

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Type numberPackagePackage descriptionTotal product weight
PESD5V0S1BASOD323SOD24.49960 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934058004135212601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
9340580041151612601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000001.11121
subTotal0.05000100.000001.11121
Lead FrameCopper alloyCopper (Cu)7440-50-81.2422597.8150027.60802
Iron (Fe)7439-89-60.025532.010000.56732
Phosphorus (P)7723-14-00.000410.032000.00903
Zinc (Zn)7440-66-60.001460.115000.03246
Pure metal layerCopper (Cu)7440-50-80.000060.005000.00141
Silver (Ag)7440-22-40.000290.023000.00649
subTotal1.27000100.0000028.22473
Mould CompoundAdditiveNon hazardousProprietary0.088452.900001.96573
Triphenylphosphine603-35-00.001520.050000.03389
FillerSilica -amorphous-7631-86-92.1960072.0000048.80434
PigmentCarbon black1333-86-40.001520.050000.03389
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4575015.0000010.16757
Phenol Formaldehyde resin (generic)9003-35-40.3050010.000006.77838
subTotal3.05000100.0000067.78380
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000060.055500.00136
Tin solderTin (Sn)7440-31-50.1099399.940002.44319
subTotal0.11000100.000002.44466
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0196099.990000.43555
subTotal0.01960100.000000.43559
total4.49960100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.