Chemical content PESD5V0S1BLD-Q

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Type numberPackagePackage descriptionTotal product weight
PESD5V0S1BLD-QSOD882DDFN1006-20.69000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934665473315112601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33043
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04552
Phenolic resinProprietary0.0004113.530000.05883
DieDoped siliconSilicon (Si)7440-21-30.05000100.000007.24638
Lead FrameCopper alloyChromium (Cr)7440-47-30.000800.257500.11643
Copper (Cu)7440-50-80.2957694.7950042.86383
Tin (Sn)7440-31-50.000750.238800.10798
Zinc (Zn)7440-66-60.000600.190800.08627
Pure metal layerGold (Au)7440-57-50.000170.055000.02487
Nickel (Ni)7440-02-00.013394.292001.94073
Palladium (Pd)7440-05-30.000530.170900.07728
Mould CompoundFillerSilica -amorphous-7631-86-90.0687723.000009.96667
Silica fused60676-86-00.1794060.0000026.00000
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.008973.000001.30000
Ion trapping agentBismuth (Bi)7440-69-90.001500.500000.21667
PigmentCarbon black1333-86-40.001500.500000.21667
PolymerEpoxy resin systemProprietary0.020937.000003.03333
Phenolic resinProprietary0.017946.000002.60000
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00014
Non hazardousProprietary0.000010.055500.00177
Tin solderTin (Sn)7440-31-50.0219999.940003.18649
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalGold (Au)7440-57-50.0040099.990000.57965
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.