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Chemical content PESD5V0S1UL

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Type numberPackagePackage descriptionTotal product weight
PESD5V0S1ULSOD882DFN1006-20.94224 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340599763151412601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.80659
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11112
Phenolic resinProprietary0.0013513.530000.14359
subTotal0.01000100.000001.06130
DieDoped siliconSilicon (Si)7440-21-30.04800100.000005.09424
subTotal0.04800100.000005.09424
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.11575
Magnesium (Mg)7439-95-40.000820.200000.08703
Nickel (Ni)7440-02-00.012923.150001.37067
Silicon (Si)7440-21-30.002830.690000.30024
Pure metal layerGold (Au)7440-57-50.000120.030000.01305
Nickel (Ni)7440-02-00.005211.270000.55262
Palladium (Pd)7440-05-30.000700.170000.07397
subTotal0.41000100.0000043.51333
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000010.98446
Silica fused60676-86-00.2700060.0000028.65512
Flame retardantMetal hydroxideProprietary0.013503.000001.43276
ImpurityBismuth (Bi)7440-69-90.002250.500000.23879
PigmentCarbon black1333-86-40.002250.500000.23879
PolymerEpoxy resin systemProprietary0.031507.000003.34310
Phenolic resinProprietary0.027006.000002.86551
subTotal0.45000100.0000047.75853
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00118
Tin solderTin (Sn)7440-31-50.0199999.940002.12133
subTotal0.02000100.000002.12261
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0042499.990000.44995
subTotal0.00424100.000000.44999
total0.94224100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.