Chemical content PESD5V0U1BL-Q

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Type numberPackagePackage descriptionTotal product weight
PESD5V0U1BL-QSOD882DFN1006-20.92323 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934665478315112601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.82320
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11341
Phenolic resinProprietary0.0013513.530000.14655
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.24946
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900041.96235
Magnesium (Mg)7439-95-40.000820.200000.08882
Nickel (Ni)7440-02-00.012923.150001.39889
Silicon (Si)7440-21-30.002830.690000.30642
Pure metal layerGold (Au)7440-57-50.000120.030000.01332
Nickel (Ni)7440-02-00.005211.270000.56400
Palladium (Pd)7440-05-30.000700.170000.07550
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000011.21064
Silica fused60676-86-00.2700060.0000029.24515
Flame retardantMetal hydroxideProprietary0.013503.000001.46226
ImpurityBismuth (Bi)7440-69-90.002250.500000.24371
PigmentCarbon black1333-86-40.002250.500000.24371
PolymerEpoxy resin systemProprietary0.031507.000003.41193
Phenolic resinProprietary0.027006.000002.92452
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00120
Tin solderTin (Sn)7440-31-50.0199999.940002.16501
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0032399.990000.35015
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.