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Chemical content PESD5V0U1BLD

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Type numberPackagePackage descriptionTotal product weight
PESD5V0U1BLDSOD882DDFN1006-20.66954 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065314315512601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.34053
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04691
Phenolic resinProprietary0.0004113.530000.06062
subTotal0.00300100.000000.44806
DieDoped siliconSilicon (Si)7440-21-30.03000100.000004.48069
subTotal0.03000100.000004.48069
Lead FrameCopper alloyChromium (Cr)7440-47-30.000800.257500.11999
Copper (Cu)7440-50-80.2957694.7950044.17367
Tin (Sn)7440-31-50.000750.238800.11128
Zinc (Zn)7440-66-60.000600.190800.08891
Pure metal layerGold (Au)7440-57-50.000170.055000.02563
Nickel (Ni)7440-02-00.013394.292002.00004
Palladium (Pd)7440-05-30.000530.170900.07964
subTotal0.31200100.0000046.59916
Mould CompoundFillerSilica -amorphous-7631-86-90.0687723.0000010.27123
Silica fused60676-86-00.1794060.0000026.79452
Flame retardantMetal hydroxideProprietary0.008973.000001.33973
ImpurityBismuth (Bi)7440-69-90.001500.500000.22329
PigmentCarbon black1333-86-40.001500.500000.22329
PolymerEpoxy resin systemProprietary0.020937.000003.12603
Phenolic resinProprietary0.017946.000002.67945
subTotal0.29900100.0000044.65754
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000010.055500.00182
Tin solderTin (Sn)7440-31-50.0219999.940003.28387
subTotal0.02200100.000003.28584
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0035499.990000.52837
subTotal0.00354100.000000.52842
total0.66954100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.