Chemical content PESD5V0U2BM-Q

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Type numberPackagePackage descriptionTotal product weight
PESD5V0U2BM-QSOT883XQFN30.85712 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934665481315112601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.88669
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.12215
Phenolic resinProprietary0.0013513.530000.15785
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.50009
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100046.86193
Magnesium (Mg)7439-95-40.000630.146000.07325
Nickel (Ni)7440-02-00.012532.913001.46139
Silicon (Si)7440-21-30.002710.631000.31656
MetallisationGold (Au)7440-57-50.000150.035000.01756
Nickel (Ni)7440-02-00.011852.755001.38213
Palladium (Pd)7440-05-30.000470.110000.05518
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.92860
Silica fused60676-86-00.2220060.0000025.90069
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.011103.000001.29503
Ion trapping agentBismuth (Bi)7440-69-90.001850.500000.21584
PigmentCarbon black1333-86-40.001850.500000.21584
PolymerEpoxy resin systemProprietary0.025907.000003.02175
Phenolic resinProprietary0.022206.000002.59007
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00065
Tin solderTin (Sn)7440-31-50.0099999.940001.16600
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0071299.990000.83061
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.