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Chemical content PESD5V0V2BM

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Type numberPackagePackage descriptionTotal product weight
PESD5V0V2BMSOT883XQFN30.88032 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069288315412601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.86332
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11893
Phenolic resinProprietary0.0013513.530000.15369
subTotal0.01000100.000001.13594
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.67975
subTotal0.05000100.000005.67975
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100045.62693
Magnesium (Mg)7439-95-40.000630.146000.07131
Nickel (Ni)7440-02-00.012532.913001.42288
Silicon (Si)7440-21-30.002710.631000.30822
MetallisationGold (Au)7440-57-50.000150.035000.01710
Nickel (Ni)7440-02-00.011852.755001.34570
Palladium (Pd)7440-05-30.000470.110000.05373
subTotal0.43000100.0000048.84587
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.66694
Silica fused60676-86-00.2220060.0000025.21810
Flame retardantMetal hydroxideProprietary0.011103.000001.26091
ImpurityBismuth (Bi)7440-69-90.001850.500000.21015
PigmentCarbon black1333-86-40.001850.500000.21015
PolymerEpoxy resin systemProprietary0.025907.000002.94211
Phenolic resinProprietary0.022206.000002.52181
subTotal0.37000100.0000042.03017
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00063
Tin solderTin (Sn)7440-31-50.0099999.940001.13527
subTotal0.01000100.000001.13595
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0103299.990001.17218
subTotal0.01032100.000001.17230
total0.88032100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.