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Chemical content PESD5V0X1UAB

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Type numberPackagePackage descriptionTotal product weight
PESD5V0X1UABSOD523SC-791.45343 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934064539115612601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02000100.000001.37606
subTotal0.02000100.000001.37606
Lead FrameCopper alloyCopper (Cu)7440-50-80.4579786.4100031.50981
Nickel (Ni)7440-02-00.046488.770003.19802
Tin (Sn)7440-31-50.011872.240000.81683
Pure metal layerSilver (Ag)7440-22-40.013672.580000.94081
subTotal0.53000100.0000036.46547
Mould CompoundFillerSilica fused60676-86-00.6248071.0000042.98797
PigmentCarbon black1333-86-40.002640.300000.18164
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.1733619.7000011.92765
Phenolic resinProprietary0.079209.000005.44918
subTotal0.88000100.0000060.54644
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00006
Non hazardousProprietary0.000010.055500.00076
Tin solderTin (Sn)7440-31-50.0199999.940001.37523
subTotal0.02000100.000001.37605
WirePure metalGold (Au)7440-57-50.00343100.000000.23599
subTotal0.00343100.000000.23599
total1.45343100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.