Chemical content PHB29N08T

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Type numberPackagePackage descriptionTotal product weight
PHB29N08TSOT404D2PAK1434.20936 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340571251181012451245Cabuyao, Philippines; Manchester, United Kingdom; Sherman, United States Of AmericaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.30000100.000000.16037
Lead FrameCopper alloyCopper (Cu)7440-50-8823.4241699.0800057.41311
Iron (Fe)7439-89-61.246600.150000.08692
Nickel (Ni)7440-02-06.066810.730000.42301
Phosphorus (P)7723-14-00.332430.040000.02318
Mould CompoundAdditiveBromine atom (Br)10097-32-25.705201.000000.39779
FillerMisc. Silica compounds (generic)14808-60-7439.3004077.0000030.63014
Flame retardantAntimony Trioxide (Sb2O3)1309-64-411.410402.000000.79559
PolymerEpoxy resin systemProprietary114.1040020.000007.95588
Post-PlatingImpurityNon hazardousProprietary0.001980.010000.00014
Tin alloyTin (Sn)7440-31-519.7880299.990001.37972
Solder WireLead alloyLead (Pb)7439-92-11.9728593.500000.13756
Silver (Ag)7440-22-40.031651.500000.00221
Tin (Sn)7440-31-50.105505.000000.00736
WireImpurityNon hazardousProprietary0.000030.010000.00000
Pure metalAluminium (Al)7429-90-50.2551199.990000.01779
WirePure metalAluminium (Al)7429-90-58.1634299.990000.56919
Nickel (Ni)7440-02-00.000820.010000.00006
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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