Chemical content PHPT60406NY

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Type numberPackagePackage descriptionTotal product weight
PHPT60406NYSOT669LFPAK88.28000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340685691155126030 s123520 s3Seremban, Malaysia; D-22529 HAMBURG, Germany; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.63000100.000000.71364
ClipCopper alloyCopper (Cu)7440-50-819.9740099.8700022.62574
Iron (Fe)7439-89-60.020000.100000.02266
Phosphorus (P)7723-14-00.006000.030000.00680
Lead FrameCopper alloyCopper (Cu)7440-50-837.8307699.8700042.85314
Iron (Fe)7439-89-60.037880.100000.04291
Phosphorus (P)7723-14-00.011360.030000.01287
Mould CompoundAdditiveNon hazardousProprietary0.315421.400000.35729
FillerSilica -amorphous-7631-86-91.419396.300001.60783
Silica fused60676-86-016.2216072.0000018.37517
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.450602.000000.51042
PigmentCarbon black1333-86-40.067590.300000.07656
Bromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.495662.200000.56146
Non hazardousProprietary0.991324.400001.12293
Phenol Formaldehyde resin (generic)9003-35-41.216625.400001.37814
Post-PlatingPure metalTin (Sn)7440-31-53.85000100.000004.36112
Solder PasteLead alloyLead (Pb)7439-92-13.1357592.500003.55205
Silver (Ag)7440-22-40.084752.500000.09600
Tin (Sn)7440-31-50.169505.000000.19200
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.