Chemical content PHPT60603PY

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Type numberPackagePackage descriptionTotal product weight
PHPT60603PYSOT669LFPAK68.62600 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340678791155126030 s123520 s3Seremban, Malaysia; Cabuyao, Philippines; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.48000100.000000.69944
ClipCopper alloyCopper (Cu)7440-50-81.0246499.867621.49308
Iron (Fe)7439-89-60.001030.099910.00149
Phosphorus (P)7723-14-00.000330.032470.00049
Lead FrameCopper alloyCopper (Cu)7440-50-837.8307699.8700055.12598
Iron (Fe)7439-89-60.037880.100000.05520
Phosphorus (P)7723-14-00.011360.030000.01656
Mould CompoundAdditiveNon hazardousProprietary0.315421.400000.45962
FillerSilica -amorphous-7631-86-91.419396.300002.06830
Silica fused60676-86-016.2216072.0000023.63769
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.450602.000000.65660
PigmentCarbon black1333-86-40.067590.300000.09849
Bromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.495662.200000.72226
Non hazardousProprietary0.991324.400001.44453
Phenol Formaldehyde resin (generic)9003-35-41.216625.400001.77283
Post-PlatingPure metalTin (Sn)7440-31-53.85000100.000005.61012
Solder PasteLead alloyLead (Pb)7439-92-12.6455092.500003.85495
Silver (Ag)7440-22-40.071502.500000.10419
Tin (Sn)7440-31-50.143005.000000.20838
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.