Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PIMN32-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PIMN32-QSOT457SC-7411.18818 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346641651152126030 s123520 s3Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.40000100.000003.57520
subTotal0.40000100.000003.57520
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.003190.080000.02853
Carbon (C)7440-44-00.001600.040000.01427
Chromium (Cr)7440-47-30.008380.210000.07489
Cobalt (Co)7440-48-40.016760.420000.14978
Iron (Fe)7439-89-61.8840847.2200016.83990
Manganese (Mn)7439-96-50.033920.850000.30313
Nickel (Ni)7440-02-01.4192435.5700012.68520
Phosphorus (P)7723-14-00.000800.020000.00713
Silicon (Si)7440-21-30.009980.250000.08916
Sulphur (S)7704-34-90.000800.020000.00713
Pure metal layerCopper (Cu)7440-50-80.5210913.060004.65754
Silver (Ag)7440-22-40.090172.260000.80598
subTotal3.99000100.0000035.66264
Mould CompoundFillerSilica fused60676-86-04.4412071.0000039.69549
PigmentCarbon black1333-86-40.018770.300000.16773
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2322819.7000011.01410
Phenolic resinProprietary0.562979.000005.03182
subTotal6.25522100.0000055.90914
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00014
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00023
Tin solderTin (Sn)7440-31-50.5212299.990004.65863
subTotal0.52127100.000004.65910
WirePure metalGold (Au)7440-57-50.02170100.000000.19395
subTotal0.02170100.000000.19395
total11.18818100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.